Comparison of the Thermal Expansion Behavior of Several Intermetallic Silicide Alloys Between 293 and 1523 K
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Thermal expansion measurements were conducted on hot-pressed CrSi(sub 2), TiSi(sub 2), W Si(sub 2) and a two-phase Cr-Mo-Si intermetallic alloy between 293 and 1523 K during three heat-cool cycles. The corrected thermal expansion, (L/L(sub 0)(sub thermal), varied with the absolute temperature, T, as (deltaL/L(sub 0)(sub thermal) = A(T-293)(sup 3) + B(T-293)(sup 2) + C(T-293) + D, where A, B, C and D are regression constants. Excellent reproducibility was observed for most of the materials after the first heat-up cycle. In some cases, the data from the first heatup cycle deviated from those determined in the subsequent cycles. This deviation was attributed to the presence of residual stresses developed during processing, which are relieved after the first heat-up cycle. Raj, Sai V. Glenn Research Center NASA/TM-2014-216678, E-18874, GRC-E-DAA-TN13094
| Publisher Name | Independently Published |
|---|---|
| Author Name | Hagendorf, Col |
| Format | Audio |
| Bisac Subject Major | SCI |
| Language | NG |
| Isbn 10 | 1794413464 |
| Isbn 13 | 9781794413467 |
| Target Age Group | min:NA, max:NA |
| Dimensions | 01.10" H x 00.08" L x 50.00" W |
| Page Count | 34 |
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